Table of Contents
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
What is Silver Clad Copper Foil?
Silver Clad Copper Foil is a Silver Clad Copper (Ag/Cu) material with 105% IACS conductivity, Thickness: 0.005-0.1 mm, Width: 5-12 mm, widely used in Battery & Energy Storage, Electronics Connectors, Medical Devices, and other applications. It combines the excellent properties of multiple metals, making it an ideal alternative to traditional single-metal materials.
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Silver Clad Copper Foil
Silver Clad Copper Foil features extremely high conductivity and good flexibility, suitable for precision electronic applications such as high-end battery electrodes and flexible circuits.
Material
Silver Clad Copper (Ag/Cu)
Conductivity
105% IACS
Tensile Strength
270 MPa
Dimensions
Applications
Detailed Specifications
| Specification | Value |
|---|---|
| Silver Content | 5-20% |
| Standards | ASTM B298, MIL-DTL-13543 |
| Temper | Soft |
| Surface Roughness | ≤0.1μm |
Standards & Compliance
Applicable Standards
Certifications
Typical Markets
Documents
Regional Compliance Note
We can provide product certification documents that meet local regulatory requirements based on your target market.
Frequently Asked Questions
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Application Cases
Discover how our products solve real-world challenges across various industries.
Success Story
A leading manufacturer transformed their production with our high-quality materials.
- Improved efficiency and productivity
- Cost reduction and savings
- Enhanced product quality
Real-world application in industrial setting