Table of Contents
Manufacturing Process
This product is manufactured using Clad & Weld process with metallurgical bonding. It is NOT electroplated.
Metallurgical bonding creates a permanent atomic-level connection, ensuring superior reliability compared to electroplating. This enables excellent weldability, resistance to peeling during bending, and stable performance under thermal cycling conditions.
What is Nickel Clad Copper Foil?
Nickel Clad Copper Foil is a Nickel Clad Copper (Ni/Cu) material with 90% IACS conductivity, Thickness: 0.01-0.1 mm, Width: 5-12 mm, widely used in Battery & Energy Storage, Electronics Connectors, Aerospace & Defense, and other applications. It combines the excellent properties of multiple metals, making it an ideal alternative to traditional single-metal materials.
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Nickel Clad Copper Foil
Nickel Clad Copper Foil features excellent conductivity and corrosion resistance, suitable for battery electrodes, capacitors, and electromagnetic shielding in precision electronic applications.
Material
Nickel Clad Copper (Ni/Cu)
Conductivity
90% IACS
Tensile Strength
370 MPa
Dimensions
Applications
Detailed Specifications
| Specification | Value |
|---|---|
| Nickel Content | 5-15% |
| Standards | ASTM B565, AMS 4533 |
| Temper | Soft |
| Surface Roughness | ≤0.2μm |
Standards & Compliance
Applicable Standards
Certifications
Typical Markets
Documents
Regional Compliance Note
We can provide product certification documents that meet local regulatory requirements based on your target market.
Frequently Asked Questions
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Application Cases
Discover how our products solve real-world challenges across various industries.
Success Story
A leading manufacturer transformed their production with our high-quality materials.
- Improved efficiency and productivity
- Cost reduction and savings
- Enhanced product quality
Real-world application in industrial setting